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RISA Procedure for Automated Shape and Life Prediction in Flip-Chip and BGA Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, a three-dimensional shape prediction model and a finite element solution procedure for flip-chip and BGA solder joints are developed. The developed system is capable of calculating ...
The Nature of Centroidal Locus in Misaligned Flip-Chip Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The self-alignment mechanism of molten flip-chip solder joints is being increasingly used in passive alignment of optoelectronic devices. For these applications, three-dimensional models of misaligned ...
LGA Connectors: An Automated Design Technique for a Shrinking Design Space
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The ever-increasing demand for higher-density interconnection between a multi-chip module and the printed circuit board has resulted in the emergence of Land-Grid Array (LGA) connectors as an ...
A Two-Body Formulation for Solder Joint Shape Prediction
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Solder shape prediction is essential for accurate fatigue life determination and joint design optimization. In the present paper, a new solution approach using the surface tension theory is ...
A Reconciliation of Local and Global Models for Bone Remodeling Through Optimization Theory
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Remodeling rules with either a global or a local mathematical form have been proposed for load-bearing bones in the literature. In the local models, the bone architecture (shape, density) is ...
The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: As a follow-up and conclusion to previous work in stencil printing process modeling and optimization (Li et al., 1996), we investigate the effect of stencil printing optimization on the reliability ...
Reliability Simulations for Solder Joints Using Stochastic Finite Element and Artificial Neural Network Models
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The field reliability of solder joints depends on the manufacturing process tolerance of design parameters and on the capability of manufacturing processes to achieve the tolerance. This process ...
The Impact of Interfacial Adhesion on PTH and Via Stress State
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper the impact of the state of barrel-laminate adhesion on the PTH and via stresses is investigated. A representative PTH and a representative blind via in a printed wiring board ...
Maximizing Solder Joint Reliability Through Optimal Shape Design
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The automated search techniques from the field of numerical optimization provide tools that enable optimal design of electronic packages in general, and solder joints in particular. However, there ...
A Nonlinear Fracture Mechanics Approach to Modeling Fatigue Crack Growth in Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Predicting the fatigue life of solder interconnections is a challenge due to the complex nonlinear behavior of solder alloys and the importance of the load history. Long experience with Sn–Pb ...