Abstract: Forced convection air cooling of an array of low profile, card-mounted components has been investigated. A simulated array is attached to one wall of a low aspect ratio duct. This is the ...

Abstract: Forced convection cooling of a simulated array of card-mounted electronic components has been investigated. An important feature of the simulated components is their relatively low profile ...

Abstract: The effect of variations in stream-wise spacing and component length on convection from rectangular, surface mounted components in a channel flow are reported. Component dimensions are the same ...

Abstract: An experimental study of forced convection heat transfer is reported. Direct air cooling of an electronics packaging system is modeled by a channel flow, with an array of uniformly sized and ...