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    Evaluation of Nonintrusive Active Infrared Thermography Technique to Detect Hidden Solder Ball Defects on Plastic Ball Grid Array Components 

    Source: Journal of Electronic Packaging:;2014:;volume( 136 ):;issue: 003:;page 31008
    Author(s): Giron; Fu, Xin; Hernandez; Ramos
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: It is essential for electronics reliability to develop effective methodologies to detect hidden solder joint defects. Active infrared thermography is an alternative to Xray detection methodologies. The limits of active ...
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    Study on the Distribution Character of the Spatial Transport Linkage of Beijing-Tianjin Metropolitan Area 

    Source: Journal of Highway and Transportation Research and Development (English Edition):;2007:;Volume ( 002 ):;issue: 001
    Author(s): Liu Xin; Wu Yong-ping; Fu Xin
    Publisher: American Society of Civil Engineers
    Abstract: The distribution character of regional spatial transport linkage is an important part of spatial transport linkage. The aim is the integrated rapid passenger system based on railway, highway, and air transport. Based on ...
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    Lumped Parameter Modeling of an Immersion Flow Field for Analyzing Meniscus Dynamic Behavior 

    Source: Journal of Dynamic Systems, Measurement, and Control:;2014:;volume( 136 ):;issue: 001:;page 11001
    Author(s): Chen, Ying; Lee, Kok; Lin, Chun; Fu, Xin
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Motivated by the interest to increase production throughputs of immersion lithography machines, wafers are scanned at increasingly high velocities and accelerations, which may result in liquid loss at the receding contact ...
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