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    Analytical Solutions of Stresses in a Cylindrical Plate Due to Polynomial Radial Temperature Distributions 

    Source: Journal of Electronic Packaging:;1993:;volume( 115 ):;issue: 002:;page 214
    Author(s): Frank F. H. Wu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Thermal stress is a significant contributor to a component’s failure during manufacturing processes. In the electronic industry, for example, it is very common that components experience an ...
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