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    Influence of Hot Electron Scattering and Electron–Phonon Interactions on Thermal Boundary Conductance at Metal/Nonmetal Interfaces 

    Source: Journal of Heat Transfer:;2014:;volume( 136 ):;issue: 009:;page 92401
    Author(s): Giri, Ashutosh; Foley, Brian M.; Hopkins, Patrick E.
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: It has recently been demonstrated that under certain conditions of electron nonequilibrium, electron to substrate energy coupling could represent a unique mechanism to enhance heat flow across interfaces. In this work, we ...
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    The Doping Dependence of the Thermal Conductivity of Bulk Gallium Nitride Substrates 

    Source: Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 004:;page 041112-1
    Author(s): Song, Yiwen; Lundh, James Spencer; Wang, Weijie; Leach, Jacob H.; Eichfeld, Devon; Krishnan, Anusha; Perez, Carlos; Ji, Dong; Borman, Trent; Ferri, Kevin; Maria, Jon-Paul; Chowdhury, Srabanti; Ryou, Jae-Hyun; Foley, Brian M.; Choi, Sukwon
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Gallium nitride (GaN) has emerged as one of the most attractive base materials for next-generation high-power and high-frequency electronic devices. Recent efforts have focused on realizing vertical power device structures ...
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