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Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Demand is growing for the dense and high-performing IT computing capacity to support artificial intelligence, deep learning, machine learning, autonomous cars, the Internet of Things, etc. This led to an unprecedented ...
Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The ability of traditional room-conditioning systems to accommodate expanding information technology loads is limited in contemporary data centers (DCs), where the storage, storing, and processing of data have grown quickly ...