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RISSurface Graft Copolymerization Enhanced Lamination of Poly(tetrafluoroethylene) Film to Copper and Epoxy-Based Print Circuit Board (PCB)
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Lamination of poly(tetrafluoroethylene) (PTFE) film to a copper foil or to an epoxy-based print circuit board (PCB) Substrate (FR4®) was carried out. Lamination was achieved during surface ...