Abstract: Improvements in thermal interface materials (TIMs) can enhance heat transfer in electronics packages and reduce high temperatures. TIMs are generally composed of highly conductive particle fillers ...

Abstract: To improve performance and reliability of integrated circuits, accurate knowledge of thermal transport properties must be possessed. In particular, reduced dimensions increase boundary scattering ...

Abstract: This work is aimed at cooling small surfaces (1.3 mm × 2 mm and 3 mm × 5 mm) using spray from thermal ink jet (TIJ) atomizers. Particular interests in this work include obtaining ...