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RISCleaning and Reflow of Pb-Sn C4 Solder Bumps
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The Pb/Sn electroplating process for C4 technology requires the ability to etch Ball Limiting Metallurgy (BLM) in the presence of the Pb/Sn bumps. Upon etching, a surface corrosion layer is ...