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RISSimulation and Property Characterization of Nanoparticle Thermal Conductivity for a Microscale Selective Laser Sintering System
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Current additive manufacturing (AM) technologies are typically limited by the minimum feature sizes of the parts they can produce. This issue is addressed by the microscale selective laser sintering system (μ-SLS), which ...
Predicting Electrical Resistivity of Sintered Copper Nanoparticles From Simulations for the Microscale Selective Laser Sintering Process
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: One of the main challenges facing the expansion of Additive Manufacturing (AM) is the minimum feature sizes which these processes are able to achieve. Microscale Selective Laser Sintering (μ-SLS) is a novel Additive ...
Nanoparticle Sintering Model: Simulation and Calibration Against Experimental Data
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: One of the limitations of commercially available metal additive manufacturing (AM) processes is the minimum feature size most processes can achieve. A proposed solution to bridge this gap is microscale selective laser ...
A Comprehensive Study of the Sintering of Copper Nanoparticles Using Femtosecond, Nanosecond, and Continuous Wave Lasers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A high electrical and thermal conductivity coupled with low costs make copper (Cu) an enticing alternative to aluminum for the fabrication of interconnects in packaging applications. To tap into the benefits of the ...