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    Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages 

    Source: Journal of Electronic Packaging:;2007:;volume( 129 ):;issue: 004:;page 373
    Author(s): Pradeep Lall; Dhananjay Panchagade; Yueli Liu; Wayne Johnson; Jeff Suhling
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Portable electronics is subjected to extreme accelerations in shock and drop impact. Product development cycle times and the cost constraints often restrict the number of design variations tested ...
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