Abstract: In this paper, continuous SiC fibers were embedded in an Al 6061 O matrix through ultrasonic consolidation at room temperature. The optimum embedding parameters were determined through peel tests ...

Abstract: The reliability of fine pitch Sn–3.8Ag–0.7Cu flip chip solder joints with three different pads, i.e., bare pads, pads with solder masks, and pads with microvia, on printed circuit boards (PCBs) ...

Abstract: This research seeks to characterize the micro-mechanical behavior of Sn-Ag-Cu solder bumps/joints generated by fine pitch flip chip assembly processes. The solder bumps and joints that were aged ...

Abstract: The sustainability of a metro system is important not only to itself but also to local socioeconomic development. However, very few methodologies can be found for assessing the sustainability of metro systems, especially ...

Abstract: This study investigated whether the relationships of personality with safety compliance and safety participation remains significant when safety-specific transformational leadership is supplied by supervisors. It also ...