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    Substructure Stiffness and Mass Updating through Minimization of Modal Dynamic Residuals 

    Source: Journal of Engineering Mechanics:;2016:;Volume ( 142 ):;issue: 005
    Author(s): Dapeng Zhu; Xinjun Dong; Yang Wang
    Publisher: American Society of Civil Engineers
    Abstract: This research studies a substructure finite element model updating approach that requires vibration data from only part of a large structure (i.e., a substructure). The residual structure is condensed using a limited ...
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    Integration of Ta–N Thin Film Resistors on Anodic Alumina MCM-D Substrate 

    Source: Journal of Electronic Packaging:;2009:;volume( 131 ):;issue: 001:;page 11006
    Author(s): Dapeng Zhu; Xiaoqin Lin; Le Luo
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The aim of this work is to evaluate the changes in microstructures and electrical properties of a tantalum nitride (Ta–N) thin film integrated on an aluminum anodization multichip module deposited ...
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    Substructure Stiffness and Mass Updating through Minimization of Modal Dynamic Residuals 

    Source: Journal of Engineering Mechanics:;2016:;Volume ( 142 ):;issue: 005
    Author(s): Dapeng Zhu; Xinjun Dong; Yang Wang
    Publisher: American Society of Civil Engineers
    Abstract: This research studies a substructure finite element model updating approach that requires vibration data from only part of a large structure (i.e., a substructure). The residual structure is condensed using a limited number ...
    Request PDF
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    DSpace software copyright © 2002-2015  DuraSpace
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