Abstract: Conventional flip chip on board processing involves four major steps: flux application, solder reflow, underfill flow, and underfill cure. The latter two steps are particularly time consuming. ...

Abstract: One of the critical steps in the production of microcellular polymers is the dissolution of gas into a polymer matrix. In this paper, the formation of a gas and semi-crystalline thermoplastic ...

Abstract: The compliant nature of flexible substrates subject to assembly forces can result in severe misregistration of the component leads and substrate bond pads, leading to assembly process defects. ...