Abstract: Experiments were carried out to investigate the effect of reversing the heat flux direction during cooling on the formation of voids during the reflow process. Under different upward and downward ...

Abstract: Understanding the formation of voids in solder joints is important for predicting the long-term reliability of solder interconnects. This paper reports experimental research on the formation of ...

Abstract: This paper reports the experimental findings of void formation in eutectic and lead-free solder joints of flip-chip assemblies. A previous theory indicated that the formation of voids is determined ...