Abstract: Amplification of thermal waves in response to high-frequency excitations is studied in this work. The resonance behavior is explored along with the underdamped behavior in thermal wave oscillations. ...

Abstract: We consider the generalized micro heat transfer model in a 1D microsphere with N-carriers and Neumann boundary condition in spherical coordinates, which can be applied to describe nonequilibrium ...

Abstract: The ever increasing power density in modern semiconductor devices requires heat dissipation solution such as heat sink to remove heat away from the device. A compressive loading is usually ...

Abstract: In order to protect the electronic components of electronic devices on a printed circuit board (PCB) against electromagnetic radiation, a conductive shield-can or box is normally attached to the ...