Abstract: Thermally-induced failure is a major reliability issue for electronic packaging. Due to the highly nonlinear behaviors and thermal mismatch of packaging materials, an electronic package exhibits ...

Abstract: In this paper, the creep behavior of a flip-chip package under a thermal load was investigated by using nonlinear finite element technique coupled with high density laser moiré interferometry. ...

Abstract: Instantaneous-response and transient-flow component models for the prediction of the transient response of gas turbine cycles are presented. The component models are based on applications of the ...

Abstract: This paper presents transient-flow component models for the prediction of the transient response of gas turbine cycles. The application is to predict the transient response of a small solar-powered ...