Abstract: Fundamental study of deformation and fatigue fracture behavior of solder alloys under complex load conditions is a key to enabling implementation of sophisticated three-dimensional (3D) time-dependent ...

Abstract: The thermomechanical behaviors of a new lead free solder and eutectic 63Sn37Pb are investigated in this paper. A series of tests including tensile, creep, and fatigue, are carried out on a ...

Abstract: Solutions for axisymmetric profiles of solder joints formed between a cylindrical pin and a printed circuit board (PCB) are presented. The dimensionless differential equation governing the formation ...