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Nondestructive Failure Analysis and Simulation of Encapsulated 0402 Multilayer Ceramic Chip Capacitors Under Thermal and Mechanical Loading
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The use of multilayer ceramic chip capacitors as integrated passive in, e.g., system in package applications needs methods to examine and predict their reliability. Therefore, a nondestructive ...
Evaluating the Capacity of Freeway Weaving Sections
Publisher: American Society of Civil Engineers
Abstract: The research described in this paper employed simulation modeling and empirical observations in an effort to: (1) Identify the traffic flow phenomena that characterize freeway weaving section capacity; and (2) determine ...
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