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    A Mechanistic Model for Solder Joint Failure Prediction Under Thermal Cycling 

    Source: Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 002:;page 104
    Author(s): Boon Wong; D. E. Helling
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A mechanistic model for eutectic Pb/Sn solder life predictions has been developed and applied to leadless surface mount solder joints. This model can quantitatively describe both crack initiation ...
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    An Experimental Investigation of the Yield Loci of 1100-0 Aluminum, 70:30 Brass, and an Overaged 2024 Aluminum Alloy After Various Prestrains 

    Source: Journal of Engineering Materials and Technology:;1986:;volume( 108 ):;issue: 004:;page 313
    Author(s): D. E. Helling; M. G. Stout; A. K. Miller
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The multiaxial yield behaviors of 1100-0 aluminum, 70:30 brass, and an overaged 2024 aluminum alloy (2024-T7) have been investigated for a variety of prestress histories involving combinations ...
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