Search
CSV
RISNumerical Modeling of Forced Convection Heat Transfer for Modules Mounted on Circuit Boards
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Numerical simulation of the fluid and heat transfer characteristics of electronic modules mounted on circuit boards is performed using a commercial finite-control-volume code, PHOENICS. The model ...
Thermal Model of a PC
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper presents an alternative approach to modeling box cooling in electronic packages. A finite-control-volume simulation code is used to simulate an IBM desktop Personal Computer. Only the ...
Effect of Variable Heat Transfer Coefficient, Fin Geometry, and Curvature on the Thermal Performance of Extended Surfaces
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A constant heat transfer coefficient is often assumed in the computation of the temperature distribution along an extended surface. This assumption permits the use of a well-established closed ...
Three-Dimensional CFD Model of Pressure Drop in µTAS Devices in a Microchannel
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Microposts are utilized to enhance heat transfer, adsorption/desorption, and surface chemical reactions. In a previous study [Yeom et al. , J. Micromech. Microeng., 19, p. 065025 (2009)], based ...
Study of Insulating Properties of Alkanethiol Self-Assembled Monolayers Formed Under Prolonged Incubation Using Electrochemical Impedance Spectroscopy
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The electrochemical interfacial properties of a well-ordered self-assembled monolayer (SAM) of 1-undecanethiol (UDT) on evaporated gold surface have been investigated by electrochemical impedance ...