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    Demonstration of a Compliant Microspring Array as a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules 

    Source: Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 003:;page 031114-1
    Author(s): Cui, Jin; Pan, Liang; Weibel, Justin A.
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Pluggable optoelectronic transceiver modules are widely used in the fiber-optic communication infrastructure. It is essential to mitigate thermal contact resistance between the high-power optical module and its riding heat ...
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    Cloud Based Intelligent User Interface for Cloud Manufacturing: Model, Technology, and Application 

    Source: Journal of Manufacturing Science and Engineering:;2015:;volume( 137 ):;issue: 004:;page 40910
    Author(s): Ren, Lei; Cui, Jin; Li, Ni; Wu, Qiong; Ma, Cuixia; Teng, Dongxing; Zhang, Lin
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Cloud manufacturing is gradually transforming the way enterprises do business from traditional productionoriented manufacturing to serviceoriented manufacturing. The development of cloud manufacturing in industry practice ...
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    Effect of Electromagnetic Force on Dynamic Mechanical Properties of the Magnetorheological Elastomer Under Compression Mode 

    Source: Journal of Engineering Materials and Technology:;2020:;volume( 142 ):;issue: 002:;page 021004-1
    Author(s): Shi, Xinxin; Liu, Shaogang; Zhao, Dan; Zhao, Zhenghang; Cui, Jin; Wang, Feihao
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Under the compression mode, the direction of force on the magnetorheological elastomer (MRE) is parallel to the direction of electromagnetic force, so the effect of electromagnetic force on its dynamic mechanical properties ...
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