Abstract: With the increase in power consumption in compact electronic devices, passive heat transfer cooling technologies with high-heat-flux characteristics are highly desired in microelectronic industries. ...

Abstract: A silicon heat spreader, called hexcell, is presented to develop thin, strong, interconnected, and scalable heat transfer devices for high power electronics cooling. Several key technical aspects, ...

Abstract: Helicopter blades are known to experience complicated unsteady flow conditions during high-speed forward flight. Transonic shock takes place along the advancing side, which decreases the performance of the blades and results ...