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RISFabrication of Miniature CMOS Image Sensor Using Novel Glass Cover Chip Packaging Technique
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This study develops a novel glass cover chip (GCC) technique for the packaging of CMOS image sensors (CIS), in which the glass cover plate is attached directly to the chip using a nonconductive ...
A Modified Flip-Chip LED Packaging Design With Enhanced Light Coupling Efficiency for Plastic Optical Fiber Networks
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The explosive growth in the use of the Internet and multimedia applications in both the home and the office has fueled the requirement for high-bandwidth communication systems capable of ...