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RISBoiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In order to meet the increasing performance demand of high-performance computing and edge computing, thermal design power (TDP) of central processing unit (CPU) and graphics processing unit (GPU) needs to increase. This ...