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Thermal Performance of Microelectronic Substrates With Submillimeter Integrated Vapor Chamber
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: We develop a vapor chamber integrated with a microelectronic packaging substrate and characterize its heat transfer performance. A prototype of vapor chamber integrated printed circuit board (PCB) is fabricated through ...
Thermal Performance of Microelectronic Substrates With Submillimeter Integrated Vapor Chamber
Publisher: American Society of Mechanical Engineers (ASME)
Abstract: We develop a vapor chamber integrated with a microelectronic packaging substrate and characterize its heat transfer performance. A prototype of vapor chamber integrated printed circuit board (PCB) is fabricated through ...