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    Thermal Performance of Microelectronic Substrates With Submillimeter Integrated Vapor Chamber 

    Source: Journal of Heat Transfer:;2019:;volume( 141 ):;issue: 005:;page 51401
    Author(s): Cho, Sangbeom; Joshi, Yogendra
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: We develop a vapor chamber integrated with a microelectronic packaging substrate and characterize its heat transfer performance. A prototype of vapor chamber integrated printed circuit board (PCB) is fabricated through ...
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    Thermal Performance of Microelectronic Substrates With Submillimeter Integrated Vapor Chamber 

    Source: Journal of Heat Transfer:;2019:;volume( 141 ):;issue: 005:;page 51401
    Author(s): Cho, Sangbeom; Joshi, Yogendra
    Publisher: American Society of Mechanical Engineers (ASME)
    Abstract: We develop a vapor chamber integrated with a microelectronic packaging substrate and characterize its heat transfer performance. A prototype of vapor chamber integrated printed circuit board (PCB) is fabricated through ...
    Request PDF
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    DSpace software copyright © 2002-2015  DuraSpace
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