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    Influences of Solder Wetting on Self-Alignment Accuracy and Modeling for Optoelectronic Devices Assembly 

    Source: Journal of Electronic Packaging:;2012:;volume( 134 ):;issue: 002:;page 21002
    Author(s): Ming Kong; Sungeun Jeon; Chiwon Hwang; Y. C. Lee
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Solder self-alignment is an important phenomenon enabling cost-effective optoelectronics assembly. In this study, the wetting of Sn-rich solder to under bump metallization (UBM) pads is identified ...
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