YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    Search 
    •   YE&T Library
    • Search
    •   YE&T Library
    • Search
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Search

    Show Advanced FiltersHide Advanced Filters

    Filters

    Use filters to refine the search results.

    Now showing items 1-3 of 3

    • Relevance
    • Title Asc
    • Title Desc
    • Year Asc
    • Year Desc
    • 5
    • 10
    • 20
    • 40
    • 60
    • 80
    • 100
  • Export
    • CSV
    • RIS
    • Sort Options:
    • Relevance
    • Title Asc
    • Title Desc
    • Issue Date Asc
    • Issue Date Desc
    • Results Per Page:
    • 5
    • 10
    • 20
    • 40
    • 60
    • 80
    • 100

    Evolution of Nanoparticle Deposits Printed Using Electrospray 

    Source: Journal of Micro and Nano-Manufacturing:;2015:;volume( 003 ):;issue: 001:;page 14502
    Author(s): Brown, Nicholas A.; Gladstone, Jessica N.; Chiarot, Paul R.
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In an electrospray, large electric potentials are used to generate a spray of highly charged droplets. Colloidal dispersions, consisting of nanoparticles in a volatile solvent, can be atomized using electrospray. Printing ...
    Request PDF

    Minimizing the Effects of On-Chip Hotspots Using Multi-Objective Optimization of Flow Distribution in Water-Cooled Parallel Microchannel Heatsinks 

    Source: Journal of Electronic Packaging:;2020:;volume( 143 ):;issue: 002:;page 021007-1
    Author(s): Hadad, Yaser; Radmard, Vahideh; Rangarajan, Srikanth; Farahikia, Mahdi; Refai-Ahmed, Gamal; Chiarot, Paul R.; Sammakia, Bahgat
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The industry shift to multicore microprocessor architecture will likely cause higher temperature nonuniformity on chip surfaces, exacerbating the problem of chip reliability and lifespan. While advanced cooling technologies ...
    Request PDF

    Thermal Analysis of Cold Plate for Direct Liquid Cooling of High Performance Servers 

    Source: Journal of Electronic Packaging:;2019:;volume( 141 ):;issue: 004:;page 41005
    Author(s): Ramakrishnan, Bharath; Hadad, Yaser; Alkharabsheh, Sami; Chiarot, Paul R.; Sammakia, Bahgat
    Publisher: American Society of Mechanical Engineers (ASME)
    Abstract: Data center energy usage keeps growing every year and will continue to increase with rising demand for ecommerce, scientific research, social networking, and use of streaming video services. The miniaturization of ...
    Request PDF
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     

    Author

    ... View More

    Publisher

    Year

    Type

    Content Type

    Publication Title

    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian