Search
Now showing items 1-1 of 1
Underfill Filler Settling Effect on the Die Backside Interfacial Stresses of Flip Chip Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Underfill is usually modeled as an isotropic medium containing uniformly distributed filler particles. However, filler particles tend to settle (or segregate) and thus alter the mechanical response ...