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    Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading 

    Source: Journal of Electronic Packaging:;2008:;volume( 130 ):;issue: 002:;page 24502
    Author(s): Samson Yoon; Changsoo Jang; Bongtae Han
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A nonlinear finite element modeling (FEM) scheme to analyze the combined effect of thermal and hygroscopic deformation is presented. The scheme employs the conventional moisture diffusion, heat ...
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    Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem 

    Source: Journal of Electronic Packaging:;2008:;volume( 130 ):;issue: 001:;page 11004
    Author(s): Changsoo Jang; Bongtae Han; Samson Yoon; Seungbae Park
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: We propose an advanced thermal-moisture analogy scheme to cope with the inherent limitations of the existing analogy schemes. The new scheme is based on the experimentally observed unique ...
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    Measurement of Transient Dynamic Response of Circuit Boards of a Handheld Device During Drop Using 3D Digital Image Correlation 

    Source: Journal of Electronic Packaging:;2008:;volume( 130 ):;issue: 004:;page 44502
    Author(s): S. B. Park; Chirag Shah; Jae B. Kwak; Changsoo Jang; Soonwan Chung; James M. Pitarresi
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this work, a new experimental methodology for analyzing the drop impact response is assessed using a pair of high-speed digital cameras and 3D digital image correlation software. Two different ...
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