Abstract: The reliability of fine pitch Sn–3.8Ag–0.7Cu flip chip solder joints with three different pads, i.e., bare pads, pads with solder masks, and pads with microvia, on printed circuit boards (PCBs) ...

Abstract: This research seeks to characterize the micro-mechanical behavior of Sn-Ag-Cu solder bumps/joints generated by fine pitch flip chip assembly processes. The solder bumps and joints that were aged ...

Abstract: The anisotropic shear strength of rough joints is examined from both experiments and numerical simulations in this paper. The rough joints in the experiment are prepared by combining 3D laser scanning and 3D printing ...