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    Laser Shock Peening of Nanoparticles Integrated Alloys: Numerical Simulation and Experiments 

    Source: Journal of Manufacturing Science and Engineering:;2010:;volume( 132 ):;issue: 006:;page 61017
    Author(s): Chang Ye; Gary J. Cheng
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Nanocomposite and multiphase structures have become more important nowadays to enhance the mechanical properties of materials. Laser shock peening (LSP) is one of the most efficient ways to ...
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    Effects of Temperature on Laser Shock Induced Plastic Deformation: The Case of Copper 

    Source: Journal of Manufacturing Science and Engineering:;2010:;volume( 132 ):;issue: 006:;page 61009
    Author(s): Chang Ye; Gary J. Cheng
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Laser shock induced plastic deformation has been used widely, such as laser shock peening (LSP), laser dynamic forming (LDF), and laser peen forming. These processes have been extensively studied ...
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    Deformation Behaviors and Critical Parameters in Microscale Laser Dynamic Forming 

    Source: Journal of Manufacturing Science and Engineering:;2009:;volume( 131 ):;issue: 005:;page 51011
    Author(s): Huang Gao; Chang Ye; Gary J. Cheng
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Microscale laser dynamic forming (μLDF) is a novel microfabrication technique to introduce complex 3D profiles in thin films. This process utilizes pulse laser to generate plasma to induce ...
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    Distributed Fiber Optic Sensing of Axially Loaded Bored Piles 

    Source: Journal of Geotechnical and Geoenvironmental Engineering:;2018:;Volume ( 144 ):;issue: 003
    Author(s): Pelecanos Loizos;Soga Kenichi;Elshafie Mohammed Z. E. B.;de Battista Nicholas;Kechavarzi Cedric;Gue Chang Ye;Ouyang Yue;Seo Hyung-Joon
    Publisher: American Society of Civil Engineers
    Abstract: Instrumented pile tests are vital to establish the performance of a pile and validate the assumptions made during initial design. Conventional instrumentation includes vibrating wire strain gauges and extensometers to ...
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