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RISInfluence of Glass Transition Temperature of Underfill on the Stress Behavior and Reliability of Microjoints Within a Chip Stacking Architecture
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this study, the reliability performance of two capillarytype underfill materials with different glass transition temperatures (Tg) and coefficients of thermal expansion (CTE) were assessed for a chip stacking architecture. ...
ST-TransNet: A Spatiotemporal Transformer Network for Uncertainty Estimation from a Single Deterministic Precipitation Forecast
Publisher: American Meteorological Society