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    Effects of Orientation on Critical Heat Flux From Chip Arrays During Flow Boiling 

    Source: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 003:;page 290
    Author(s): C. O. Gersey; I. Mudawar
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Boiling experiments were performed with FC-72 on a series of nine in-line simulated microelectronic chips in a flow channel to ascertain the effects of channel orientation on critical heat flux ...
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    Nucleate Boiling and Critical Heat Flux From Protruded Chip Arrays During Flow Boiling 

    Source: Journal of Electronic Packaging:;1993:;volume( 115 ):;issue: 001:;page 78
    Author(s): C. O. Gersey; I. Mudawar
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The effects of chip protrusion on the forced-convection boiling and critical heat flux (CHF) of a dielectric coolant (FC-72) were investigated. The multi-chip module used in the present study ...
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