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    A Comparison of the Solderability of Wrought and Plated Nickel Surfaces: The Selection of a Reliable Pin for Second Level Packaging 

    Source: Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 003:;page 223
    Author(s): C. G. Woychik; A. K. Trivedi
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The solderability of a wrought nickel pin directly overplated with gold and that of a wrought kovar (tradename of an Fe-Ni-Co alloy manufactured by Carpenter Technology Corporation) pin plated ...
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