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RISA Modeling Approach for Predicting the Abrasive Particle Motion During Chemical Mechanical Polishing
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Chemical mechanical polishing (CMP) is a manufacturing process in which a wafer surface is polished by pressing it against a rotating pad that is flooded with slurry. The slurry itself is a ...
Development of New Faculty: Summary of the NSF-CMS WEE Workshop
Publisher: American Society of Civil Engineers
Abstract: The National Science Foundation-Civil and Mechanical Systems (NSF-CMS) Workshop on the Advancement and Retention of Underrepresented and Minority Engineering Educators (WEE) 2003 brought together approximately 75 future, ...