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    Mathematical Modeling of Transport Phenomena During Alloy Solidification 

    Source: Applied Mechanics Reviews:;1993:;volume( 046 ):;issue: 001:;page 1
    Author(s): C. Beckermann; R. Viskanta
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Mathematical modeling of mass, momentum, heat, and species transport phenomena occurring during solidification of metal alloys is reviewed. Emphasis is placed on the incorporation of the effects ...
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    Use of a Two-Dimensional Simulation Model in the Thermal Analysis of a Multi-Board Electronic Module 

    Source: Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 002:;page 126
    Author(s): C. Beckermann; B. Pospichal; T. F. Smith
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A study is reported of heat transfer and air flow in an electronic module consisting of an array of narrowly spaced vertical circuit boards with highly-protruding components contained in a ...
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    Combined Conduction, Natural Convection, and Radiation Heat Transfer in an Electronic Chassis 

    Source: Journal of Electronic Packaging:;1991:;volume( 113 ):;issue: 004:;page 382
    Author(s): T. F. Smith; S. W. Weber; C. Beckermann
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A numerical study of the combined heat transfer by conduction, natural convection, and radiation in a sealed electronic package is reported. The goal of the study is to investigate the importance ...
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