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RISBehavior of Polymeric Substrates and Sintered Silver Printed Hybrid Electronic Assemblies Subject to Extreme Acceleration Levels and Elevated Temperatures
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper focuses on the response of printed hybrid electronic (PHE) assemblies with polymeric substrates and additively manufactured sintered silver electrical traces subject to extreme mechanical shocks (up to 100,000 g) ...