Search
CSV
RISRemaining Useful Life Estimation and Prognostication of SAC305 Printed Circuit Boards for Dynamic Conditions of Temperature and Vibration Loads
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This study focuses on the feature vector identification and remaining useful life (RUL) estimation of SAC305 solder alloy printed circuit boards (PCBs) of two different configurations during varying conditions of temperature ...
Epoxy-Printed Circuit Board Interfacial Fracture Reliability Under Three-Point and Four-Point Bend Loading After Sustained Elevated Temperature Exposure1
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The survivability and reliability of commercial electronic components under very high thermo-mechanical loads are improved using underfilling and potting methods. Potting protects from operating conditions such as moisture, ...
High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Electronic components are subject to high strain, during shock and vibration in many applications such as the automobile and aerospace. In many cases, this kind of electronic components will also be exposed to harsh ...