Search
CSV
RISDie Cracking at Solder (In60-Pb40) Joints on Brittle (GaAs) Chips: Fracture Correlation Using Critical Bimaterial Interface Corner Stress Intensities
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: We study cracking from the interface of an In60-Pb40 solder joint on a brittle GaAs die when the joint is subjected to a uniform temperature change. Our primary objective is to apply and ...