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    From Incident Laser Pulse to Residual Stress: A Complete and Self-Closed Model for Laser Shock Peening 

    Source: Journal of Manufacturing Science and Engineering:;2007:;volume( 129 ):;issue: 001:;page 117
    Author(s): Benxin Wu; Yung C. Shin
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Laser shock peening (LSP) is emerging as a competitive alternative technology to classical treatments to improve fatigue and corrosion properties of metals for a variety of important applications. ...
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    Parametric Study on Single Shot and Overlapping Laser Shock Peening on Various Metals via Modeling and Experiments 

    Source: Journal of Manufacturing Science and Engineering:;2010:;volume( 132 ):;issue: 006:;page 61010
    Author(s): Yunfeng Cao; Benxin Wu; Yung C. Shin
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Laser shock peening (LSP) under water confinement regime involves several complicated physical phenomena. Among these phenomena, the interaction between laser and coating material during LSP is ...
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    Laser-Assisted Milling of Silicon Nitride Ceramics and Inconel 718 

    Source: Journal of Manufacturing Science and Engineering:;2008:;volume( 130 ):;issue: 003:;page 31013
    Author(s): Yinggang Tian; Benxin Wu; Mark Anderson; Yung C. Shin
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Laser-assisted machining (LAM) has shown its potential to significantly reduce fabrication costs and improve product quality for advanced materials. While extensive studies have been conducted on ...
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    Time-Resolved Experimental Study of Silicon Carbide Ablation by Infrared Nanosecond Laser Pulses 

    Source: Journal of Manufacturing Science and Engineering:;2011:;volume( 133 ):;issue: 002:;page 21006
    Author(s): Yibo Gao; Ronald L. Jacobsen; Bill Goodman; Yun Zhou; Benxin Wu; Sha Tao
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Silicon carbide, due to its unique properties, has many promising applications in optics, electronics, and other areas. However, it is difficult to micromachine using mechanical approaches due ...
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