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    A Numerical Study of the Enhancement of Chip Cooling via a Flow-Disturbing Obstruction Block 

    Source: Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 004:;page 523
    Author(s): S. Kong Wang; Bau-Shi Pei; An-Fong Chen; Ja-Lin Du; Tzu-Chen Hung
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Two-dimensional convection heat transfer on a chip with a flow-disturbing obstruction block above it, as induced by natural coupling between flow and structure, was investigated numerically. The ...
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