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    Additive Manufacturing of a High Temperature, Ni-Based Superalloy Compact Heat Exchanger: A Study on the Role of Select Key Printing Parameters 

    Source: ASME Journal of Heat and Mass Transfer:;2023:;volume( 145 ):;issue: 004:;page 41901-1
    Author(s): Battaglia, Fabio; Zhang, Xiang; Arie, Martinus A.; Shooshtari, Amir; Sarmiento, Andres Paul; Ohadi, Michael
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Compared to state-of-the-art heat exchangers, manifold-microchannel heat exchangers have shown superior heat removal density (kW/kg) at moderate pressure drops. However, manifold-microchannel heat exchangers made of Ni-based ...
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    Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes 

    Source: Journal of Electronic Packaging:;2021:;volume( 143 ):;issue: 003:;page 031006-1
    Author(s): Battaglia, Fabio; Singer, Farah; Deisenroth, David C.; Ohadi, Michael M.
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this paper, we present the results of an experimental study involving low thermal resistance cooling of high heat flux power electronics in a forced convection mode, as well as in a thermosiphon (buoyancy-driven) mode. ...
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