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    Simulative Analysis on Factors Influencing Solder Joint Bridging of Fine Pitch Devices 

    Source: Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 001:;page 22
    Author(s): Li Ming Yu; Wang Chun Qing; Zhang Lei; Bang Han Sur; Kim Young Pyo
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Solder bridging is one of the most serious defects of solder joint in fine pitch device assemblies. It is known that the generation of solder bridging is closely related to the forming process ...
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