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RISSingle Phase Liquid Cooling of High Heat Flux Devices With Local Hotspot in a Microgap With Nonuniform Fin Array
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Single-phase liquid cooling in microchannels and microgaps has been successfully demonstrated for heat fluxes of ∼1 kW/cm2 for silicon chips with maximum temperature below 100 °C. However, effectively managing localized ...
Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Three-dimensional (3D) stacked integrated circuit (SIC) chips are one of the most promising technologies to achieve compact, high-performance, and energy-efficient architectures. However, they face a heat dissipation ...
Three Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper reports on novel thermal testbeds with embedded micropinfin heat sinks that were designed and microfabricated in silicon. Two micropinfin arrays were presented, each with a nominal pin height of 200 خ¼m and ...
Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: As integration levels increase in next generation electronics, high power density devices become more susceptible to hotspot formation, which often imposes a thermal limitation on performance. Flow boiling of R134a in two ...