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RISDeformation Mechanism of Two-Phase Solder Column Interconnections Under Highly Accelerated Thermal Cycling Condition: An Experimental Study
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermomechanical behavior of solder interconnections of a ceramic column grid array package assembly is characterized by high sensitivity moiré interferometry. The in situ thermal deformations of ...
Thermal Deformation Analysis of Various Electronic Packaging Products by Moiré and Microscopic Moiré Interferometry
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermo-mechanical behavior of various levels of electronic packaging products is studied by moiré and microscopic moiré interferometry. The global deformations of packages with complex geometries ...
Flip-Chip BGA Design to Avert Die Cracking
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Fracture mechanics is applied to flip-chip BGA design to avert die cracking from its backside. Fracture mechanics is integrated with the finite element analysis (FEA) and design of virtual ...
Warpage Measurement on Dielectric Rough Surfaces of Microelectronics Devices by Far Infrared Fizeau Interferometry1
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Far infrared Fizeau interferometry is developed and it is proposed as a tool for warpage measurement of microelectronics devices. The method provides a whole-field map of surface topography with ...
Micro-Mechanical Deformation Analysis of Surface Laminar Circuit in Organic Flip-Chip Package: An Experimental Study
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermo-mechanical deformations of microstructures in a surface laminar circuit (SLC) substrate are quantified by microscopic moiré interferometry. Two specimens are analyzed; a bare SLC substrate ...
Bending Analysis of Simply Supported Shear Deformable Skew Plates
Publisher: American Society of Civil Engineers
Abstract: This paper presents the bending analysis of a simply supported, thick skew plate based on the first-order shear deformation Reissner/Mindlin theory. Using the geometric transformation, the governing differential equations ...
Analysis of Moderately Thick Circular Plates Using Differential Quadrature Method
Publisher: American Society of Civil Engineers
Abstract: In this paper, the axisymmetric bending analysis of moderately thick circular plates based on the Reissner-Mindlin plate theory is conducted numerically by using the differential quadrature (DQ) method. The governing ...
Bending Solution for Thick Plates with Quadrangular Boundary
Publisher: American Society of Civil Engineers
Abstract: A numerical solution technique, which is based on the differential quadrature method, is presented for investigation of the static characteristics of thick Reissner/Mindlin plates on quandrangular planforms. The basic idea ...
Verification of Numerical Models Used in Microelectronics Packaging Design by Interferometric Displacement Measurement Methods
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Verified/predictive modeling has become an integral part of electronic packaging product development in order to reduce costs and cycle time. In this paper, interferometric displacement measurement ...
The Strength of the Silicon Die in Flip-Chip Assemblies
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The mechanical reliability of silicon dies is affected by the defects introduced by surface grinding and edge dicing. The ring-on-ring and the four-point-bend test have been used in this study ...