Abstract: In electronics packaging, one of the key processes is dispensing fluid materials, such as adhesive, epoxy, encapsulant, onto substrates or printed circuit boards for the purpose of surface ...

Abstract: Fluid dispensing is a process widely used in electronics packaging manufacturing, by which fluid materials are delivered in a controlled manner for the purpose of bonding, sealing, coating, or ...

Abstract: A method to evaluate the probability of failure of a failure path leading to fatigue collapse of an offshore structure is presented. The failure path is modeled by a number of failure elements, ...

Abstract: The process of sequential three point bending (or “bumpforming”) is often used to produce smoothly varying simple curvature parts. The process involves bending and incrementing the bend line in ...

Abstract: Recent emphasis of the Department of Defense (DOD) on the reliability and integrity of avionics has spurred a new wave of research on this subject. This paper presents the results of a ...

Abstract: Fluid dispensing systems have been widely employed in industry, by which fluid materials are delivered in a controllable manner. Currently, various designs of fluid dispensing systems exist; ...

Abstract: The in vitro culture process via bioreactors is critical to create tissue-engineered constructs (TECs) to repair or replace the damaged tissues/organs in various engineered applications. In the ...

Abstract: Dispensing technique is one of the promising solid freeform (SFF) methods to fabricate scaffolds with controllable pore sizes and porosities. In this paper, a model to represent the dispensing-based ...