Abstract: An experimental investigation of the flow boiling of dielectric refrigerant R245fa is conducted in microgaps with enhancement features. A silicon microgap of height 200 μm populated with pin fin arrays of diameter 150 μm ...

Abstract: Threedimensional (3D) stacked electronics present significant advantages from an electrical design perspective, ranging from shorter interconnect lengths to enabling heterogeneous integration. However, multitier stacking ...