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RISTest Method Development to Quantify the In Situ Elastic and Plastic Behavior of 62%Sn–36%Pb–2%Ag Solder Ball Arrays in Commercial Area Array Packages at −40°C, 23 °C, and 125 °C
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The objective of this study is to describe and evaluate test methods developed to experimentally characterize the in situ mechanical behavior of solder ball arrays connecting printed wiring ...
Experimental In Situ Characterization and Creep Modeling of Tin-Based Solder Joints on Commercial Area Array Packages at −40°C, 23°C, and 125°C
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The objective of this work was to experimentally determine the in situ creep behavior and constitutive model equations for a commercial area array package and printed wiring board assembly at ...