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RISA Study on Warpage of Flexible SS Substrates for Large Area MCM-D Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper presents potential application of stainless steel (SS) as a base substrate material for large area multi-chip module-deposited (MCM-D) packaging. Preliminary results on via formation ...
Measurement of Dynamic Warpage During Thermal Cycling of Dielectric Coated SS Substrates for Large Area MCM-D Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Potential application of stainless steel (SS) as a base substrate material for a large area MCM-D packaging is reported in this paper. A test vehicle was fabricated using 0.008 in. thick and ...